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Ultrasound microwire soldering system

micro-wire bonder

Model 4523 (Kulicke & Soffa). It is used to solder electrical contacts to thin films, as necessary to study electrical transport properties (resistivity, magnetoresistivity, Hall effect, etc).

Main specifications

  • Wire diameter: 25 to 50 microns.
  • Types of wires: aluminum with 1% of silicon; gold.


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Page last modified on February 20, 2018, at 08:17 PM.